NEEM 6431 Microelectronics Processing I (3 sem. cr.)
This course is an introduction to the bipolar and MOSFET semiconductor process. Students learn about the theory and practice of the major unit processes used in modern silicon device processing; for example, oxidation; diffusion; ion implantation; Deep-UV, phase-shift, UV, electron, and X-ray lithography; metal and oxide deposition; aqueous, plasma, and reactive ion etching; chemical mechanical polishing; and wet-cleaning for front-end- and back-end-of-the-line. Students explore issues relating to performance integration, the effects of subsequent and prior process steps on a fabrication sequence, and limiting process steps in producing devices for the Gigabit era.

 

NEEM 6441 Introduction to MEMS Design (3 sem. cr.)
This course provides a summary of integrated circuit fabrication technologies leading into an overview of the technologies available to shape electromechanical elements on a submillimeter scale. The physics of MEMS devices are covered at a level necessary to design and analyze new devices and systems. Several commercially available MEMS processes are discussed in detail, and students design final projects in these processes.